Bambu Lab PC (1.75mm, 1kg)
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Bambu PC
RFID for Intelligent Printing
All printing parameters are embedded in RFID, which can be read through our AMS (Automatic Material System).
Load and print! No more tedious setting steps.
Accessory Compatibility
| Recommended | Not Recommended | |
| Build Plate | Engineering Plate, High Temperature Plate or Textured PEI Plate | Cool Plate |
| Hotend | All Size / Material | / |
| Glue | Bambu Glue Stick | Bambu Liquid Glue |
Recommended Printing Settings
Drying Settings (Blast Drying Oven):
80 °C，8h
Printing and Keeping Container's Humidity:
< 20% RH (Sealed, with Desiccant)
Nozzle Temperature:
250 - 270 °C
Bed Temperature (with Glue):
90 - 110 °C
Printing Speed:
< 300 mm/s
Physical Properties
Density:
1.20 g/cm³
Vicat Softening Temperature:
119 °C
Heat Deflection Temperature:
117 °C
Melting Temperature:
2228 °C
Melt Index:
32.2 ± 2.9 g/10 min
Mechanical Properties
Tensile Strength:
55 ± 4 MPa
Breaking Elongation Rate:
3.8 ± 0.3 %
Bending Modulus:
2310 ± 70 MPa
Bending Strength:
108 ± 4 MPa
Impact Strength:
434.8 ± 2.1 kJ/m²
Downloads
Printing Tips
• Due to the transparent properties of the filament, Lidar Extrusion Calibration can be affected when printing Transparent PC.
• Bambu PC needs proper drying before printing, recommended drying temperature is 80 ℃ for 8 hours in a blast drying oven, or 100 ℃ for 12 hours on a printer's heatbed. For more details please refer to: Filament drying cover on WIKI.
What's in the Box?
Filament with Spool*1 & Desiccant*1
Filament Label*1
Package*1
Instructions*1 & Spool Sticker*1
