The diamond particles also reinforce the polymer structure, improving the stiffness, strength and adhesion between printed layers. The material also has a significantly higher temperature resistance than standard PLA, with a heat deflection temperature of 107C (125C for annealed components). The filament is suitable for consumer-grade and professional FDM/FFF 3D printers. The unique combination of stiffness, strength, wear resistance and unique thermal features makes it an excellent choice for functional mechanical prints.